The OnePlus 5 has the latest Qualcomm Snapdragon 835
chipset under its hood, supported by either 6 GB of RAM and 64 GB of storage or 8 GB of RAM and 128 GB of storage, depending on the model.
The results show an overall 13 percent performance increase thanks to Apple's new A8
chipset under the hood.
However, there is an all - new
chipset under the hood with a 1.7 GHz octa - core CPU and 1 GB of RAM.
The MX5 has already leaked a number of times revealing a 5.5 - inch handset with QHD display and an octa - core MediaTek
chipset under the hood.
The Huawei P9 features the Kirin 955
chipset under its hood, along with 3 GB of RAM and 32 GB of internal storage, or 4 GB of RAM and 64 GB of storage, depending on the region.
There is a Qualcomm Snapdragon 400
chipset under the smartphone which comes along with a 1.4 GHz quad - core CPU and 1.5 GB of RAM.
It also has the faster MediaTek MT8783
chipset under the hood, a dual - camera setup on the back, with two 13 MP sensors, a fingerprint scanner, and a higher resolution selfie snapper — 8 MP.
The rumored Samsung Galaxy J7 (2016) will reportedly come with a massive 5.5 - inch Super AMOLED screen and a more than capable 8 - core Exynos 7870
chipset under the hood.
The manufacturer has used a Qualcomm Snapdragon 801
chipset under the hood, which is a tweaked version of the Snapdragon 800, with a 2.5 GHz quad - core CPU and 2 GB of RAM.
The Honor V8 features Kirin 950
chipset under its hood.
The company previously shared that its upcoming device will have a USB - C port, a Qualcomm Snapdragon 810 version 2.1
chipset under the hood and it will run OnePlus» own version of Android, OxygenOS.
However, the reported presence of 4G LTE hints that the company would use previously announced Qualcomm Snapdragon 210
chipset under its new smartphones to offer affordable smartphone experience with high - speed data connectivity.
With a MediaTek MT6737T quad - core 1.45 GHz
chipset under the hood, the Xperia L1 can hardly be described as a mobile heavyweight.
The honor 8 Pro rocks Huawei's super fast Kirin 960
chipset under its hood together with 6 GB RAM.
The smartphone comes with the latest Snapdragon 835
chipset under the hood along with 4 GB of RAM.
You'll find the slightly older but still powerful Snapdragon 821
chipset under the hood, which also powers devices like the LG G6 and last year's OnePlus 3T.
You'll find the same Snapdragon 625
chipset under the hood and a slightly smaller battery at 4,000 mAh.
The Nexus 6P comes with a Qualcomm Snapdragon 810
chipset under the hood — that's the same one that overheated in a number of phones in the past but Huawei claims all is fine here.
The Nexus 5 comes with Qualcomm's latest
chipset under its hood, the quad - core 2.3 GHz Snapdragon 800 found in the latest devices including the Samsung Galaxy Note 3, LG G2 and Sony Xperia Z1.
One of the big ones is that the HTC One X is the first smartphone to ship with a quad - core Tegra 3
chipset under the hood: it runs at 1.5 GHz across all four ARM Cortex - A9 cores, comes with the improved 12 - core ULP GeForce GPU and 1 GB of RAM.
The Q Marshal and Q Wander both sport the Qualcomm Snapdragon 210
chipset under the hood, each with 4 GB of internal storage to full from.
You'll find the Exynos 7870
chipset under the hood along with 2 GB of RAM.
There is an all - new Apple A8
chipset under the hood with 64 - bit architecture.
The new smartphones come with the Snapdragon 835
chipset under the hood and a dual - camera setup on the back.
The handsets are also expected to come with the Kirin 970
chipset under the hood, same as the Mate 10 series.
But it's a little more powerful, with a newer
chipset under the hood.
There is not going to be any Snapdragon
chipset under the hood as HTC is sticking with MediaTek chipsets for its budget phones.
It was revealed earlier that the eDGe is using a Marvell
chipset under the hoods.
You'll find the Snapdragon 820
chipset under the hood along with 4 GB of RAM.
The more interesting two of those three pack Nvidia's Tegra 4
chipset under the hood.
Its siblings, the P9 and the P9 Plus were launched earlier this month with the Kirin 955
chipset under their hood.
Wrote software tools used for verification and validation testing of CPU - video
chipsets under development.
Not exact matches
The internal working of the smartphone is carried out
under the supervision of the Cortex A5 MSM 7227A
chipset running at a speed of 1 GHz.
Under the hood, is an octa - core
chipset clocked at 1.6 GHz, paired with 3 GB RAM and 32 GB storage, or 4 GB RAM with 64 GB of internal storage.
Under the hood, both the smartphones are powered by Samsung Exynos 9810
chipset in India.
However, this isn't the first time the PlayBook has suffered a delay as it changed its
chipset partner mid way while the tablet was still
under development.
This might not be Qualcomm's latest
chipset, but it is an established one and it is
under the hood of many excellent devices.
Under the hood is 1.3 GHz quad - core MediaTek MT8321 processor which is an entry level
chipset.
Under the hood, a Rockchip RK3288
chipset can be found.
Under the hood, it is powered by a Qualcomm Snapdragon 425 quad - core
chipset clocked at 1.4 GHz, accompanied by 2 GB of RAM and 16 GB of internal storage, which is further expandable up to 128 GB.
Under the hood of the Intex Aqua Eco 3G is a 1 GHz dual - core MTK 6572AX
chipset coupled with 256 MB of RAM and 512 MB of internal storage.
Under the hood, the smartphone is powered by a Qualcomm Snapdragon 430
chipset, clocked at 1.4 GHz, which is accompanied by 4 GB of RAM, and 32 GB of on - board storage, which is further expandable up to 128 GB via microSD card.
Under - the - hood, there is a 1.4 GHz quad - core Qualcomm Snapdragon 425
chipset, clubbed with 3 GB of RAM and 16 GB of internal storage.
Under the hood is a Hexa core Exynos 7872
chipset (2 GHz A73 x 2 + 1.6 GHz A53 x 4) coupled with Mali - G71 MP3 GPU.
Under the hood is 1.5 GHz hexa - core Qualcomm Snapdragon 650 processor with Adreno 510 GPU.The
chipset is backed by 3 GB RAM and 32 GB internal storage space.
The Samsung Galaxy Tab S2 has a 64 - bit octo - core
chipset with 3 GB of RAM
under the hood.
LG pulled the covers off their Android - powered Optimus 2X smartphone, revealing the first handset to pack a Tegra 2
chipset — featuring a 1 GHz dual - core processor —
under its hood.
Under the hood, it is powered by a four - core Snapdragon 425
chipset with a 1.4 GHz Cortex - A53 processor, which is accompanied by 2 GB of RAM.
Under the hood lies a powerful 64 - bit octa - core Qualcomm Snapdragon 615
chipset with ARM CPU cores.
Under the hood, Asus Transformer TF300T will be houses in Quad - Core NVIDIA Tegra 3
chipset and powered by new Qualcomm Snapdragon APQ8060A dual - core processor which offer clocking speed of 1.2 GHz, 1 GB of DDR2 RAM and running on latest Android 4.0 Ice Cream Sandwich as the operating system provide stable platform for multi tasking, playing games, internet browsing, streaming video on the internet and much more.