Sentences with phrase «chipset under the hood»
Its siblings, the P9 and the P9 Plus were launched earlier this month with the Kirin 955 chipset under their hood.
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The more interesting two of those three pack Nvidia's Tegra 4 chipset under the hood.
You'll find the Snapdragon 820 chipset under the hood along with 4 GB of RAM.
It was revealed earlier that the eDGe is using a Marvell chipset under the hoods.
There is not going to be any Snapdragon chipset under the hood as HTC is sticking with MediaTek chipsets for its budget phones.
But it's a little more powerful, with a newer chipset under the hood.
The handsets are also expected to come with the Kirin 970 chipset under the hood, same as the Mate 10 series.
The new smartphones come with the Snapdragon 835 chipset under the hood and a dual - camera setup on the back.
There is an all - new Apple A8 chipset under the hood with 64 - bit architecture.
You'll find the Exynos 7870 chipset under the hood along with 2 GB of RAM.
The Q Marshal and Q Wander both sport the Qualcomm Snapdragon 210 chipset under the hood, each with 4 GB of internal storage to full from.
One of the big ones is that the HTC One X is the first smartphone to ship with a quad - core Tegra 3 chipset under the hood: it runs at 1.5 GHz across all four ARM Cortex - A9 cores, comes with the improved 12 - core ULP GeForce GPU and 1 GB of RAM.
The Nexus 5 comes with Qualcomm's latest chipset under its hood, the quad - core 2.3 GHz Snapdragon 800 found in the latest devices including the Samsung Galaxy Note 3, LG G2 and Sony Xperia Z1.
The Nexus 6P comes with a Qualcomm Snapdragon 810 chipset under the hood — that's the same one that overheated in a number of phones in the past but Huawei claims all is fine here.
You'll find the same Snapdragon 625 chipset under the hood and a slightly smaller battery at 4,000 mAh.
You'll find the slightly older but still powerful Snapdragon 821 chipset under the hood, which also powers devices like the LG G6 and last year's OnePlus 3T.
The smartphone comes with the latest Snapdragon 835 chipset under the hood along with 4 GB of RAM.
The honor 8 Pro rocks Huawei's super fast Kirin 960 chipset under its hood together with 6 GB RAM.
With a MediaTek MT6737T quad - core 1.45 GHz chipset under the hood, the Xperia L1 can hardly be described as a mobile heavyweight.
The company previously shared that its upcoming device will have a USB - C port, a Qualcomm Snapdragon 810 version 2.1 chipset under the hood and it will run OnePlus» own version of Android, OxygenOS.
The Honor V8 features Kirin 950 chipset under its hood.
The manufacturer has used a Qualcomm Snapdragon 801 chipset under the hood, which is a tweaked version of the Snapdragon 800, with a 2.5 GHz quad - core CPU and 2 GB of RAM.
The rumored Samsung Galaxy J7 (2016) will reportedly come with a massive 5.5 - inch Super AMOLED screen and a more than capable 8 - core Exynos 7870 chipset under the hood.
It also has the faster MediaTek MT8783 chipset under the hood, a dual - camera setup on the back, with two 13 MP sensors, a fingerprint scanner, and a higher resolution selfie snapper — 8 MP.
The Huawei P9 features the Kirin 955 chipset under its hood, along with 3 GB of RAM and 32 GB of internal storage, or 4 GB of RAM and 64 GB of storage, depending on the region.
The MX5 has already leaked a number of times revealing a 5.5 - inch handset with QHD display and an octa - core MediaTek chipset under the hood.
However, there is an all - new chipset under the hood with a 1.7 GHz octa - core CPU and 1 GB of RAM.
The results show an overall 13 percent performance increase thanks to Apple's new A8 chipset under the hood.
The OnePlus 5 has the latest Qualcomm Snapdragon 835 chipset under its hood, supported by either 6 GB of RAM and 64 GB of storage or 8 GB of RAM and 128 GB of storage, depending on the model.
Not exact matches
Under the hood, is an octa - core chipset clocked at 1.6 GHz, paired with 3 GB RAM and 32 GB storage, or 4 GB RAM with 64 GB of internal storage.
Under the hood, both the smartphones are powered by Samsung Exynos 9810 chipset in India.
This might not be Qualcomm's latest chipset, but it is an established one and it is under the hood of many excellent devices.
Under the hood is 1.3 GHz quad - core MediaTek MT8321 processor which is an entry level chipset.
Under the hood, a Rockchip RK3288 chipset can be found.
Under the hood, it is powered by a Qualcomm Snapdragon 425 quad - core chipset clocked at 1.4 GHz, accompanied by 2 GB of RAM and 16 GB of internal storage, which is further expandable up to 128 GB.
Under the hood of the Intex Aqua Eco 3G is a 1 GHz dual - core MTK 6572AX chipset coupled with 256 MB of RAM and 512 MB of internal storage.
Under the hood, the smartphone is powered by a Qualcomm Snapdragon 430 chipset, clocked at 1.4 GHz, which is accompanied by 4 GB of RAM, and 32 GB of on - board storage, which is further expandable up to 128 GB via microSD card.
Under - the - hood, there is a 1.4 GHz quad - core Qualcomm Snapdragon 425 chipset, clubbed with 3 GB of RAM and 16 GB of internal storage.
Under the hood is a Hexa core Exynos 7872 chipset (2 GHz A73 x 2 + 1.6 GHz A53 x 4) coupled with Mali - G71 MP3 GPU.
Under the hood is 1.5 GHz hexa - core Qualcomm Snapdragon 650 processor with Adreno 510 GPU.The chipset is backed by 3 GB RAM and 32 GB internal storage space.
The Samsung Galaxy Tab S2 has a 64 - bit octo - core chipset with 3 GB of RAM under the hood.
LG pulled the covers off their Android - powered Optimus 2X smartphone, revealing the first handset to pack a Tegra 2 chipset — featuring a 1 GHz dual - core processor — under its hood.
Under the hood, it is powered by a four - core Snapdragon 425 chipset with a 1.4 GHz Cortex - A53 processor, which is accompanied by 2 GB of RAM.
Under the hood lies a powerful 64 - bit octa - core Qualcomm Snapdragon 615 chipset with ARM CPU cores.
Under the hood, Asus Transformer TF300T will be houses in Quad - Core NVIDIA Tegra 3 chipset and powered by new Qualcomm Snapdragon APQ8060A dual - core processor which offer clocking speed of 1.2 GHz, 1 GB of DDR2 RAM and running on latest Android 4.0 Ice Cream Sandwich as the operating system provide stable platform for multi tasking, playing games, internet browsing, streaming video on the internet and much more.
The Note 8 has the most power under the hood thanks to the Snapdragon 835 chipset and 6 GB of RAM.
Under the hood, the Elife uses an octa - core MediaTek chipset, which, despite its eight cores, is more mid-range than high - end component.
Part of that is obviously due to the high - end Snapdragon chipset Google used, but we also have some of the under - the - hood performance tweaks to thank.
Under the hood, the new iMac is running on a 3.5 GHz quad - core i5 processor, with the option to upgrade to a 4 GHz i7 chipset.
Under the hood, the devices come powered by the latest HiSilicon Kirin 970 AI chipset with a dedicated NPU.