Accessing the coherent heat conduction regime opens a new venue for
phonon engineering.
The latest investigations on the thermal properties of silicon, the most common material in electronics, micro - and nano - electro - mechanical systems (MEMS and NEMS) and photonics, have pointed to nanostructuring as a highly efficient approach to acoustic
phonon engineering [1 - 3].
Not exact matches
For example, if an
engineer desires a material with certain thermal properties, the mean free path distribution could serve as a blueprint to design specific «scattering centers» within the material — locations that prompt
phonon collisions, in turn scattering heat propagation, leading to reduced heat carrying ability.
Even in the case of the extensively studied group IV semiconductors, measurements of
phonon lifetimes are scarce and the impact of strain
engineering is not well understood.
It is shown that the acoustic
phonon lifetimes can be tuned both by strain
engineering of the suspended structures and strain modification by temperature variation in addition to a strong dependence on the thickness of the suspended structures [1].